Submicron film material tester available

The instrument innovation project jointly completed by the Shanghai Institute of Silicate and the Institute of Metals of the Chinese Academy of Sciences has recently passed the acceptance test of the "Multi-micrometer Comprehensive Tester for Thermal Physics of Submicron/Micrometer Thin Film Materials".

This experimental device can comprehensively measure the thermal conductivity and coefficient of thermal expansion of various films with a thickness of 900 nm to 300 nm in the temperature range of -60°C to 220°C. It is characterized by high speed, high precision, full automaticity, and multi-function. Before, no similar products have been seen at home and abroad. The thermal physical properties data of 8 kinds of thin-film materials such as inorganic nonmetals, metals, and organic polymers that have been measured show that the instrument has reached and partially surpassed all the technical specifications and development targets stipulated in the project contract.

The study of the specificity of thermal properties under micro-scale conditions of thin-film materials is currently at the forefront and hotspot in the field of material thermal properties research in the world. The successful development of this sub-micron film material tester not only provides a brand-new service platform for the study of the thermal properties of thin film materials, but also provides a key technical means for the study of the thermophysical property specificity and microscale heat transfer properties of two-dimensional materials. .

Source: Plastic Business